Heart Release Design of Electronic Parts
Nawadays, electronic parts become smaller and smaller, and the packaging higher and higher in density. Heat release from electronic parts during operation affects the life span of other electronic parts integrated together, and furthermore electronic equipment itself which integrated those parts. Therefore, it is very important to incorporate appropriate heat release capability at design stage based on data obtained by measuring temperature of electronic parts.
Since those electronic parts are very small, the conventional touching-type measuring method, such as the thermocouple cannot measure correct temperature, because touched thermocouple absorbs the heat from the parts of small heat capacity by conduction. TVS is widely used for the heat release design effort since TVS can capture correctly the entire temperature distribution of the object without touching to the object and displays it as thermal image.
Temperature Measurement in Stationary State
Analyzing the temperature distribution data in stationary state helps to design the heat releasing, such as regulating heat generation of parts itself or reinforcing cooling capability within the equipment.
- Temperature Distribution of QFP (Qund-Flat-Package)&Temperature Distribution of LSl
(by TVS-8100 with Close Up Lens)
Temperature Changes right after Turning Power ON
By displaying temperature change on a Printed Circuit Board right after power is supplied, non-uniform characteristics among the parts can be seen.
- Temperature Change of Printed Circuit Board after power is supplied
(by TVS-8100 with Standard Lens)