Quality Control of Wire Bonding
Wire Bonding is used for fabrication of most advanced electronic parts, such as high densely packaged Hybrid IC and MCM.
Before wire bonding is carried out, a work will be preheated in the heater stage.
In this stage, TVS can be used to verify whether the bonding portions (electrodes, leads, etc.) of the preheated work (lC chips, lead frames, etc.) are in proper condition of temperature distribution.
In this way, TVS is widely used for the quality control of Wire Bonding.
- Temperature Distribution of Electrode (by TVS-8100 with Microscope(10 µm))
- Temperature Distribution of Lead Frame (by TVS with Standard Lens)