Failure Analysis of Electronic Parts (Detecting Short Circuit)

Nawadays, electronic parts become smaller and smaller, and the packaging higher and higher in density.
Therefore, once a failure occurred, it is very difficult to identity the cause of failure and failed portion of the parts because of micro sized and highly dense integration.
At the failed portion with short circuit, the electrical resistance becomes extremely low, resulting in temperture increase of that portion.
Since TVS can identify the failed portion with short circuit as a portion of excessively high temperature through a microscope lens, it has been widely used for failure analysis applications.

Temperature change in IC micro chip after power is supplied.

Temperature change in IC micro chip after power is supplied. Portions of short circuit are seen in high temperature (by TVS-8100 with Microscope (10μm))

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